US Patent Issued to NICHIA on Dec. 30 for "Light-emitting module, method of manufacturing wiring substrate, and method of manufacturing light-emitting module" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,513,824, issued on Dec. 30, was assigned to NICHIA Corp. (Anan, Japan).

"Light-emitting module, method of manufacturing wiring substrate, and method of manufacturing light-emitting module" was invented by Shota Takase (Tokushima, Japan), Masanori Uemura (Anan, Japan), Masakazu Sakamoto (Tokushima, Japan) and Yosuke Noda (Tokushima, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light-emitting module includes one or more light-emitting devices, and a wiring substrate. Each of the light-emitting devices includes light-emitting elements, and a package including a lower surface having a wiring region. The wiring substrate includes a metal portion, a...