ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,696, issued on Nov. 18, was assigned to NHK Spring Co. Ltd. (Yokohama, Japan).
"Bonding method" was invented by Hidetoshi Mizuta (Yokohama, Japan), Atom Furuse (Yokohama, Japan), Kaoru Nagasawa (Yokohama, Japan) and Fumitaka Arai (Yokohama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding method bonds a buffer member to an adherend member, and includes: an adhesive application step of applying an adhesive to a part of the buffer member, the part being bonded to the adherend member; a first heating step of heating a part of the adherend member, the part being bonded to the buffer member; a second heating step of heating the part of the ...