US Patent Issued to NHK Spring on June 17 for "Laminate, bonding method, and intermediate product for circuit board" (Japanese Inventor)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,117, issued on June 17, was assigned to NHK Spring Co. Ltd. (Yokohama, Japan).

"Laminate, bonding method, and intermediate product for circuit board" was invented by Takeshi Kawakami (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A laminate includes: a base material; a circuit; an insulating layer provided between the base material and the circuit, the insulating layer including a thermally conductive filler; and an adhesive configured to bond at least the base material and the insulating layer. The base material and the insulating layer are bonded by the adhesive in part and in contact with each other in other parts. A plurality of...