US Patent Issued to NGK INSULATORS on Oct. 14 for "Wafer placement table with heat dissipation sheet" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,587, issued on Oct. 14, was assigned to NGK INSULATORS Ltd. (Nagoya, Japan).

"Wafer placement table with heat dissipation sheet" was invented by Tatsuya Kuno (Nagoya, Japan), Taro Usami (Kakamigahara, Japan) and Masaki Ishikawa (Handa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer placement table includes an upper substrate; a lower substrate; a through hole extending through the lower substrate in an up-down direction; a plurality of projections provided in a dot pattern, for example, at an entirety of an upper surface of the lower substrate and being in contact with the lower surface of the upper substrate; a heat dissipation sheet ...