US Patent Issued to NGK INSULATORS on March 11 for "Bonded substrate and bonded substrate manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,249,547, issued on March 11, was assigned to NGK INSULATORS Ltd. (Nagoya, Japan).

"Bonded substrate and bonded substrate manufacturing method" was invented by Takashi Ebigase (Nagoya, Japan), Izumi Masuda (Kitanagoya, Japan) and Takeshi Kaku (Nagoya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The bonded substrate includes the silicon nitride ceramic substrate, a copper plate, the bonding layer, and penetrating regions. The copper plate and the bonding layer are patterned into a predetermined shape, and are disposed over a main surface of the silicon nitride ceramic substrate. The bonding layer bonds the copper plate to the main surface of the...