ALEXANDRIA, Va., April 2 -- United States Patent no. 12,266,515, issued on April 1, was assigned to NGK INSULATORS Ltd. (Nagoya, Japan).
"Wafer placement table" was invented by Tatsuya Kuno (Nagoya, Japan) and Seiya Inoue (Handa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer placement includes an alumina substrate having a wafer placement surface at an upper surface, and incorporating an electrode; a brittle cooling substrate which is bonded to a lower surface of the alumina substrate, and in which a refrigerant flow path is formed; and a ductile connection member stored in a storage hole opened in a lower surface of the cooling substrate in a state of restricted axial rotation and in a state ...