US Patent Issued to Nexthin Technology on Sept. 9 for "Method for manufacturing semiconductor stack structure with ultra thin die" (Taiwanese Inventor)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,776, issued on Sept. 9, was assigned to Nexthin Technology (George Town, Cayman Islands).

"Method for manufacturing semiconductor stack structure with ultra thin die" was invented by Tzu-wei Chiu (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor stack structure with an ultra-thin die includes: forming a stop layer structure inside a semiconductor substrate by ion implantation, and then providing electrical components and an inner connection layer on an active surface of the semiconductor substrate to form a semiconductor wafer; enabling inner connection layers of two semiconductor wafers to be...