US Patent Issued to Nexthin Technology on July 29 for "Method for manufacturing semiconductor stack structure with ultra thin die" (Taiwanese Inventor)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,581, issued on July 29, was assigned to Nexthin Technology (George Town, Cayman Islands).

"Method for manufacturing semiconductor stack structure with ultra thin die" was invented by Tzu-wei Chiu (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes manufacturing a plurality of wafers each having a substrate having an active surface and a backside, and a stop layer dividing the substrate into a first substrate part at a side of the active surface and a second substrate part at a side of the backside; on a first wafer of the plurality of wafers, removing the second substrate part and the stop layer; bonding a second wafer o...