US Patent Issued to Nextchip on May 27 for "Electronic device for determining bumps and depressions on ground and operation method thereof" (South Korean Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,270, issued on May 27, was assigned to Nextchip Co. Ltd. (Seongnam-si, South Korea).

"Electronic device for determining bumps and depressions on ground and operation method thereof" was invented by Young Seok Oh (Seoul, South Korea), Hye Seong Jo (Seongnam-si, South Korea) and Kyoung Tae Kim (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "In order to determine whether bumps and depressions are present on the ground in a target image, the present invention: acquires a V-disparity map on the basis of a target image acquired by means of an image sensor; detects, in the V-disparity map, at least one component indicating informat...