US Patent Issued to NEXT SILICON on Nov. 11 for "Liquid cooling assembly for electronic components on printed circuit boards and computing device including same" (Israeli Inventor)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,471,250, issued on Nov. 11, was assigned to NEXT SILICON LTD. (Givatayim, Israel).

"Liquid cooling assembly for electronic components on printed circuit boards and computing device including same" was invented by Yehuda Mizrahi (Kfar Yona, Israel).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to the technological field of microelectronics and electronic engineering, specifically to advanced liquid-cooling-based thermal management systems for electronic components on printed circuit boards. The claimed invention represents a liquid cooling assembly and a computing device that provide an improvement to the technological field...