ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,433,001, issued on Sept. 30, was assigned to Nexperia B.V. (Nijmegen, Netherlands).
"Semiconductor device and method of manufacture" was invented by Hungjin Kim (Nijmegen, Netherlands) and Phil Rutter (Nijmegen, Netherlands).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device is provided, including a substrate having a first epitaxial layer arranged thereon and a voltage blocking element arranged in the first epitaxial layer, a second epitaxial layer arranged on the first epitaxial layer, and a vertical switching element arranged in the second epitaxial layer."
The patent was filed on Jan. 11, 2022, under Application No. 17/572,861.
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