ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,673, issued on Oct. 14, was assigned to Nexperia B.V. (Nijmegen, Netherlands).
"Electronic package and method for manufacturing the same" was invented by Qingyuan Tang (Nijmegen, Netherlands).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package having a miniaturized footprint and a method for manufacturing the same is provided. Due to the arrangement of bottom contacts of the electronic package using a first partial vias, a footprint is obtained that is miniaturized with respect to the known electronic package comprising a same-sized electronic component. The electronic package according to the present disclosure enables packaging mul...