US Patent Issued to Nexperia on Nov. 18 for "Substrate-based package semiconductor device with side wettable flanks" (Dutch Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,220, issued on Nov. 18, was assigned to Nexperia B.V. (Nijmegen, Netherlands).

"Substrate-based package semiconductor device with side wettable flanks" was invented by YuJun Zhao (Nijmegen, Netherlands), JinXin Yi (Nijmegen, Netherlands), Yuan Li (Nijmegen, Netherlands), Frank Burmeister (Nijmegen, Netherlands), Jennifer Schuett (Nijmegen, Netherlands), Dicky Tirta Djaja (Nijmegen, Netherlands) and Qingyuan Tang (Nijmegen, Netherlands).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate-based package semiconductor device is provided. The present disclosure further relates to a carrier including a plurality of non-singulated substrate-based pac...