ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,751, issued on July 1, was assigned to Nexperia B.V. (Nijmegen, Netherlands).
"Semiconductor device and a method of manufacture" was invented by Ricardo Yandoc (Nijmegen, Netherlands), Florante Fenol (Nijmegen, Netherlands), Marlon Fadullo (Nijmegen, Netherlands) and Ramil Atienza (Nijmegen, Netherlands).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device including a lead frame, a die attached to the lead frame using a first solder, and a clip attached to the die using a second solder is provided. The clip includes a notch arranged for a check of the excess of the second solder."
The patent was filed on April 30, 2021, under Applica...