ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,747, issued on Aug. 19, was assigned to NEXPERIA B.V. (Nijmegen, Netherlands).
"Curved wafer stage" was invented by Joep Stokkermans (Nijmegen, Netherlands), Gijs van der Veen (Nijmegen, Netherlands), Jasper Wesselingh (Nijmegen, Netherlands) and Patrick Houben (Nijmegen, Netherlands).
According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure relates to an apparatus for transferring a semiconductor die from an arrangement of semiconductor dies to a target and to a wafer stage to be used in such an apparatus. The wafer chuck includes a rotationally mounted curved shell on which the arrangement of semiconductor dies can be arranged, and the wafer st...