US Patent Issued to Newport Fab on Oct. 28 for "Efficient integration of a first substrate without solder bumps with a second substrate having solder bumps" (California, Oregon Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,701, issued on Oct. 28, was assigned to Newport Fab LLC (Newport Beach, Calif.).

"Efficient integration of a first substrate without solder bumps with a second substrate having solder bumps" was invented by Edward Preisler (San Clemente, Calif.) and Zhirong Tang (Lake Oswego, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor structure having a first substrate capable of electrically and mechanically connecting to a second substrate includes providing a first substrate without a solder bump. A solder bump receiving metal is formed over a top interconnect metal of the first substrate. The solder bump receiving met...