ALEXANDRIA, Va., June 6 -- United States Patent no. 12,281,404, issued on April 22, was assigned to NEW MEXICO TECH UNIVERSITY RESEARCH PARK Corp. (Socorro, N.M.).

"Tin-indium alloy electroplating solution" was invented by Bhaskar S. Majumdar (Socorro, N.M.), Sherin Bhassyvasantha (Socorro, N.M.) and Luke Soule (Albuquerque, N.M.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure provides a Sn-In electroplating bath that is Pb-free, environmentally safe, operates at room temperature, and does not require changes in existing plating assemblies. Room temperature aging and limited thermal cycling tests show that the electroplated Sn-In alloy film on a Cu substrate effectively mitigates whisker growth...