US Patent Issued to Neuralink on Feb. 10 for "Die reconstitution and high-density interconnects for embedded chips" (California Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,780, issued on Feb. 10, was assigned to Neuralink Corp. (Fremont, Calif.).

"Die reconstitution and high-density interconnects for embedded chips" was invented by Supin Chen (San Ramon, Calif.), Dongjin Seo (San Francisco), Abhivyakti Gautam (Fremont, Calif.) and Zachary M Tedoff (Hayward, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods of manufacturing a sealed electrical device for embedded integrated circuit (IC) chips are described, as well as the resulting devices themselves. The sealed electrical device is created by removing material from a substrate to form a pocket in the substrate. An unencapsulated, or bare, IC chip can be pl...