US Patent Issued to Netlist on May 20 for "Memory package having stacked array dies and reduced driver load" (California Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,087, issued on May 20, was assigned to Netlist Inc. (Irvine, Calif.).

"Memory package having stacked array dies and reduced driver load" was invented by Hyun Lee (Ladera Ranch, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A DRAM packages comprises stacked array dies including at least a first array die and a stacked over at least the first array die, data terminals, via which the DRAM package receives or outputs data signals, first data interconnects between respective ones of the data terminals and the first array die, and second data interconnects distinct from the first data interconnects and between respective ones of the data terminals...