ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,547, issued on Jan. 13, was assigned to NEPES Co. LTD. (Cheongju-si, South Korea).
"Semiconductor package and method for manufacturing same" was invented by Ju Hyun Nam (Cheongju, South Korea), Jun Kyu Lee (Cheongju, South Korea), Yong Tae Kwon (Cheongju, South Korea), Su Yun Kim (Cheongju, South Korea) and Dong Hoon Oh (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package, as a semiconductor package mounted on a circuit board, includes including: a body portion including a semiconductor chip, and a first surface and a second surface opposite to each other; and a structure including n insulating layers stacked on...