ALEXANDRIA, Va., March 12 -- United States Patent no. 12,247,788, issued on March 11, was assigned to NEC Platforms Ltd. (Kanagawa, Japan).
"Heat-dissipating structure" was invented by Kazuma Sugiyama (Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat-dissipating structure (1) that can be easily retrofitted to an apparatus that needs to be waterproofed is provided. A heat-dissipating structure (1) includes a first heat-dissipating part (3) configured to receive heat from a heat-generating part (2) disposed inside a housing (8), a rod-like heat-transport member (4), the first heat-dissipating part (3) being disposed at one end thereof, and the heat-transport member (4) being configured to ...