US Patent Issued to NEC Platforms on Aug. 12 for "Package measuring apparatus and package measuring method" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,359, issued on Aug. 12, was assigned to NEC Platforms Ltd. (Kanagawa, Japan).

"Package measuring apparatus and package measuring method" was invented by Youhei Nishi (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package measuring apparatus according to the present disclosure includes: a mounting table; floatation member configured to float a package above an upper surface of the mounting table; a depth sensor configured to capture an image of the package being floated by the floatation member above the upper surface of the mounting table and thereby detect a distance between the depth sensor and the package, the depth sensor bein...