US Patent Issued to Navitas Semiconductor on June 17 for "Thermally enhanced electronic packages for GaN power integrated circuits" (California Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,421, issued on June 17, was assigned to Navitas Semiconductor Ltd. (Dublin).

"Thermally enhanced electronic packages for GaN power integrated circuits" was invented by Daniel M. Kinzer (El Segundo, Calif.), Jason Zhang (Monterey Park, Calif.) and Thomas Ribarich (Laguna Beach, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic power conversion component includes an electrically conductive package base comprising a source terminal, a drain terminal, at least one I/O terminal and a die-attach pad wherein the source terminal is electrically isolated from the die-attach pad. A GaN-based semiconductor die is secured to the die attach pad...