US Patent Issued to National University of Singapore on Sept. 30 for "Seed layer, a heterostructure comprising the seed layer and a method of forming a layer of material using the seed layer" (Singaporean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,350, issued on Sept. 30, was assigned to National University of Singapore (Singapore).

"Seed layer, a heterostructure comprising the seed layer and a method of forming a layer of material using the seed layer" was invented by Barbaros Oezyilmaz (Singapore), Chee Tat Toh (Singapore) and Irfan Haider Abidi (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A seed layer for inducing nucleation to form a layer of material is described. In an embodiment, the seed layer comprising a layer of two-dimensional monolayer amorphous material having a disordered atomic structure adapted to create localised electronic states to form electric potential wel...