US Patent Issued to National Tsing Hua University on March 18 for "Healable and recyclable polyimide polymer resin, healing method and recycling method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,252,591, issued on March 18, was assigned to National Tsing Hua University (Hsinchu, Taiwan).

"Healable and recyclable polyimide polymer resin, healing method and recycling method thereof" was invented by Ho-Hsiu Chou (Hsinchu, Taiwan) and Kuei-Yi Chuang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A healable and recyclable polyimide polymer resin includes a chemical structural unit represented by formula (I), which is defined in the description. The chemical structural unit represented by the formula (I) bonds to at least one condensation-polymerizable monomer, so as to form the healable and recyclable polyimide polymer resin, and t...