US Patent Issued to NATIONAL TSING HUA UNIVERSITY on Dec. 9 for "Thermal radiation heat dissipation device for electronic component and preparation method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,495,526, issued on Dec. 9, was assigned to NATIONAL TSING HUA UNIVERSITY (Hsinchu, Taiwan).

"Thermal radiation heat dissipation device for electronic component and preparation method thereof" was invented by Ching-Wen Hwang (Hsinchu, Taiwan), Sih-Wei Chang (Hsinchu, Taiwan), Yen-Jen Chen (Hsinchu, Taiwan), De-hui Wan (Hsinchu, Taiwan) and Hsuen-Li Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal radiation heat dissipation device for an electronic component includes a heat dissipation substrate including a heat dissipation surface having a heat dissipation surface emissivity; and an emissivity modulation layer disposed on the...