US Patent Issued to National Taiwan University of Science and Technology on April 15 for "Metallic particle-deposition substrate, method and application thereof for increasing heterointerface" (Taiwanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,276,029, issued on April 15, was assigned to National Taiwan University of Science and Technology (Taipei, Taiwan).

"Metallic particle-deposition substrate, method and application thereof for increasing heterointerface" was invented by Bing-Joe Hwang (Taipei, Taiwan), Wei-Nien Su (Taipei, Taiwan), Meng-Che Tsai (Taipei, Taiwan) and Sheng-Chiang Yang (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Present invention is related to a metallic particle-deposition substrate having a metal substrate and multiple metallic particles attached thereon. The metallic particles are nano-particles with at least 90% of these nano-particles as single layer...