ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,371, issued on May 20, was assigned to NATIONAL TAIWAN UNIVERSITY (Taipei, Taiwan) and TAIWAN SEMICONDUCTOR MANUFACURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device and manufacturing method thereof" was invented by Fang-Liang Lu (Hsinchu, Taiwan), I-Hsieh Wong (Hsinchu, Taiwan), Shih-Ya Lin (Hsinchu, Taiwan), CheeWee Liu (Hsinchu, Taiwan) and Samuel C. Pan (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first layer that includes a first semiconductor material disposed on a semiconductor substrate, and a second layer of a second semiconductor material disposed on the first layer. The semicon...