US Patent Issued to NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY on Aug. 12 for "Solid heat storage material adjusted in thermal conductivity and composite including the same" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,385,698, issued on Aug. 12, was assigned to NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (Tokyo).

"Solid heat storage material adjusted in thermal conductivity and composite including the same" was invented by Yoshiaki Kinemuchi (Nagoya, Japan), Asaya Fujita (Nagoya, Japan), Hiroyuki Nakayama (Nagoya, Japan), Kimihiro Ozaki (Nagoya, Japan) and Haruka Abe (Tsukuba, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solid heat storage material includes a bonding of vanadium dioxide and a highly thermally conductive substance higher in thermal conductivity than the vanadium dioxide, the highly thermally conductive substance being di...