US Patent Issued to NATIONAL CENTER FOR ADVANCED PACKAGING, SHANGHAI XIANFENG SEMICONDUCTOR on Dec. 30 for "Package structure for reducing warpage of plastic package wafer and method for manufacturing the same" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,392, issued on Dec. 30, was assigned to NATIONAL CENTER FOR ADVANCED PACKAGING Co. LTD (Jiangsu, China) and SHANGHAI XIANFENG SEMICONDUCTOR Co. LTD (Shanghai).

"Package structure for reducing warpage of plastic package wafer and method for manufacturing the same" was invented by Liqiang Cao (Suzhou, China), Cheng Xu (Suzhou, China), Peng Sun (Suzhou, China) and Fei Geng (Suzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention discloses a package structure for reducing warpage of plastic package wafer, including an adapter board, a chip mounted on the adapter board, and a first plastic package layer covering the chip, throu...