US Patent Issued to NANYA TECHNOLOGY on Sept. 9 for "Etching system for fabricating semiconductor device structure" (Taiwanese Inventor)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,755, issued on Sept. 9, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).

"Etching system for fabricating semiconductor device structure" was invented by Tzu-Ching Tsai (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present application discloses an etching system. The etching system includes an etch module executing a first etching recipe on a first wafer to turn a first wafer state of the first wafer to a second wafer state; a first measurement module collecting the second wafer state of the first wafer to generate a first set of data; and an artificial intelligence module coupled to the first measurement module and ...