ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,393, issued on Sept. 30, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).

"Manufacturing method for semiconductor structures" was invented by Cheng-Ta Cheng (Taoyuan, Taiwan) and Tsu-Wen Huang (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a manufacturing method for semiconductor structures. The method includes the following operations: receiving a wafer having a plurality of dies; respectively forming a plurality of semiconductor structures in a plurality of banks in each of the plurality of dies, wherein each of the semiconductor structure includes a first fin array and a second fin arr...