US Patent Issued to NANYA TECHNOLOGY on Oct. 28 for "Semiconductor device having bonding structure and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,457,733, issued on Oct. 28, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).

"Semiconductor device having bonding structure and method of manufacturing the same" was invented by Yi-Jen Lo (New Taipei, Taiwan), Chiang-Lin Shih (New Taipei, Taiwan) and Hsih-Yang Chiu (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and method for manufacturing the same are provided. The semiconductor device includes a substrate, a bonding structure, a bit line, and a word line. The bonding structure is disposed on the substrate. The bit line is disposed on the bonding structure. The channel layer is disposed on the bit lin...