ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,625, issued on Oct. 28, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).
"Planarization method of wafer" was invented by Kai Zhang (Taoyuan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of this disclosure provide a planarization method of a wafer, and the method includes the following steps. A wafer with a semiconductor structure on a front surface of the wafer is provided. A protection layer is formed on the semiconductor structure of the wafer. A pattern mask is formed on a back surface of the wafer to cover a first portion of the back surface and expose a second portion and a third portion of the back surface. Als...