US Patent Issued to NANYA TECHNOLOGY on May 6 for "Semiconductor structure having hybrid bonding pad" (Taiwanese Inventor)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,982, issued on May 6, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).

"Semiconductor structure having hybrid bonding pad" was invented by Yi-Jen Lo (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and a method of manufacturing a semiconductor structure are provided. The semiconductor structure includes a first semiconductor substrate, a first conductive pad, and a first hybrid bonding pad. The first conductive pad is over the first semiconductor substrate. The first hybrid bonding pad is on the first conductive pad. The first hybrid bonding pad includes nano-twins copper. A thickness of the fi...