US Patent Issued to NANYA TECHNOLOGY on May 6 for "Method of manufacturing tsemiconductor device having bonding structure" (Taiwanese Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,295,137, issued on May 6, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).

"Method of manufacturing tsemiconductor device having bonding structure" was invented by Yi-Jen Lo (New Taipei, Taiwan), Chiang-Lin Shih (New Taipei, Taiwan) and Hsih-Yang Chiu (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and method for manufacturing the same are provided. The semiconductor device includes a substrate, a bonding structure, a bit line, and a word line. The bonding structure is disposed on the substrate. The bit line is disposed on the bonding structure. The channel layer is disposed on the bit line. The word li...