ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,793, issued on May 27, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).
"Semiconductor device with redistribution plugs" was invented by Chun-Cheng Liao (New Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present application discloses a semiconductor device. The semiconductor device includes a first chip including a first substrate, a first redistribution layer above the first substrate, a first lower bonding pad positioned on the first redistribution layer, and a second lower bonding pad above the first substrate; and a second chip including a dense region and a loose region adjacent to the dense region, upper pads on...