ALEXANDRIA, Va., June 17 -- United States Patent no. 12,314,032, issued on May 27, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).
"Method for controlling deposition tool" was invented by Tzu-Ching Tsai (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present application discloses a method for controlling a deposition tool. The method includes executing a first deposition recipe on a current wafer; generating a first set of data of the current wafer by a first measurement module; analyzing the first set of data by an artificial intelligence module coupled to the first measurement module; generating, by the artificial intelligence module, a second deposition recipe and applying ...