US Patent Issued to NANYA TECHNOLOGY on May 20 for "Semiconductor device with etched landing pad surface" (Taiwanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,309,996, issued on May 20, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).

"Semiconductor device with etched landing pad surface" was invented by Yen-Ho Chu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and method for manufacturing the same are provided. The semiconductor device includes a substrate, a bit line, a first isolation spacer, a second isolation spacer, a capacitor contact, a landing pad, and a dielectric structure. The bit line is disposed on the substrate. The first isolation spacer is disposed on a first side of the bit line. The second isolation spacer is disposed on a second side of t...