US Patent Issued to NANYA TECHNOLOGY on May 20 for "Method for preparing fine metal lines with high aspect ratio" (Taiwanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,285, issued on May 20, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).

"Method for preparing fine metal lines with high aspect ratio" was invented by Chih-Wei Huang (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a method for preparing metal lines with a high aspect ratio including two photolithography stages. According to the design of the method of the present disclosure, first metal lines with high aspect ratio are formed in a dielectric layer, which provides a mechanical support to the first metal lines, thereby preventing the first metal lines from collapsing or deforming. Because of ...