US Patent Issued to NANYA TECHNOLOGY on March 4 for "Semiconductor device with conductive cap layer over conductive plug and method for preparinging the same" (Taiwanese Inventor)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,245,423, issued on March 4, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).

"Semiconductor device with conductive cap layer over conductive plug and method for preparinging the same" was invented by Hung-Chi Tsai (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a semiconductor device including a semiconductor substrate, word lines, mask layers, spacers, a conductive plug, a conductive cap layer, and a dielectric layer. The word lines are disposed over the semiconductor substrate. The mask layers are disposed over the plurality of word line, respectively. The spacers are disposed over oppos...