US Patent Issued to NANYA TECHNOLOGY on March 25 for "Method of manufacturing semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,262,551, issued on March 25, was assigned to NANYA TECHNOLOGY Corp. (New Taipel, Taiwan).

"Method of manufacturing semiconductor structure" was invented by Ting-Cih Kang (New Taipei, Taiwan) and Hsih-Yang Chiu (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor structure includes the following steps: providing a first semiconductor wafer, wherein the first semiconductor wafer includes a first dielectric layer and at least one first top metallization structure embedded in the first dielectric layer, and a top surface of the first dielectric layer is higher than a top surface of the first top metal...