US Patent Issued to NANYA TECHNOLOGY on March 18 for "Semiconductor device with composite conductive features and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,161, issued on March 18, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).

"Semiconductor device with composite conductive features and method for fabricating the same" was invented by Teng-Yen Huang (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a first semiconductor structure and a first connecting structure, wherein the first connecting structure includes a first connecting insulating layer positioned on the first semiconductor structure, two first conductive layers positione...