US Patent Issued to NANYA TECHNOLOGY on March 11 for "Semiconductor device structure with stacked conductive plugs and method for preparing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,249,576, issued on March 11, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).

"Semiconductor device structure with stacked conductive plugs and method for preparing the same" was invented by Yi-Hsien Chou (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device structure includes a first dielectric layer disposed over a semiconductor substrate, and a second dielectric layer disposed over the first dielectric layer. The semiconductor device structure also includes a first conductive plug disposed in the first dielectric layer. A top surface of the first conductive plug is greater than a bottom surface of the fir...