US Patent Issued to NANYA TECHNOLOGY on June 24 for "Semiconductor device having a bonding wire in a hole in the substrate" (Taiwanese Inventor)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,123, issued on June 24, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).

"Semiconductor device having a bonding wire in a hole in the substrate" was invented by Wu-Der Yang (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and method for manufacturing the same are provided. The semiconductor device includes a substrate, a first electronic component, a second electronic component, a bonding wire, and an encapsulant. The substrate has a lower surface and an upper surface opposite to the lower surface. The first electronic component is disposed on the upper surface of the substrate. The bonding wire elec...