US Patent Issued to NANYA TECHNOLOGY on June 17 for "Semiconductor structure having copper pillar within solder bump and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,463, issued on June 17, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).

"Semiconductor structure having copper pillar within solder bump and manufacturing method thereof" was invented by Hsih-Yang Chiu (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present application provides a semiconductor structure having a copper pillar within a solder bump, and a manufacturing method of the semiconductor structure. The semiconductor structure includes a substrate having a pad disposed thereon and a passivation at least partially surrounding the pad; and a conductive bump structure disposed over the passivation and the pad, whe...