ALEXANDRIA, Va., June 18 -- United States Patent no. 12,326,714, issued on June 10, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).
"Method for controlling etching tool" was invented by Tzu-Ching Tsai (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present application discloses a method for controlling an etching tool. The method includes executing a first etching recipe on a current wafer; generating a first set of data of the current wafer by a first measurement module; analyzing the first set of data by an artificial intelligence module coupled to the first measurement module; generating, by the artificial intelligence module, a second etching recipe and applying the second...