US Patent Issued to NANYA TECHNOLOGY on July 8 for "Semiconductor device with redistribution structure and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,965, issued on July 8, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).

"Semiconductor device with redistribution structure and method for fabricating the same" was invented by Shing-Yih Shih (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present application provides a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a first die; a first redistribution structure positioned on the first die; a second die positioned on the first redistribution structure and comprising a first cache unit; and a third die positioned on the first redistribution structure, sepa...