US Patent Issued to NANYA TECHNOLOGY on July 29 for "Integrated circuit package structure with conductive stair structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,609, issued on July 29, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).

"Integrated circuit package structure with conductive stair structure" was invented by Chien-Chung Wang (New Taipei, Taiwan) and Hsih-Yang Chiu (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit package structure includes a circuit board, an integrated circuit die and a conductive stair structure. The circuit has an upper surface. The integrated circuit die is located on the upper surface of the circuit board. The conductive stair structure is located on the upper surface of the circuit board. The conductive stair structure incl...