ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,200, issued on Jan. 28, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).
"Wafer inspection system method" was invented by Chia-Lin Tsai (Taoyuan, Taiwan), Hung-Ru Li (New Taipei, Taiwan) and Wun-Ye Ku (Taoyuan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer inspection method is provided. The wafer inspection method includes identifying a plurality of candidate regions on an image of a DUT on a wafer; generating a confidence score for each of the plurality of candidate regions, wherein the confidence score indicates a probability of a candidate region including a probe mark; selecting a first candidate region having the hig...